Packaging technology of integrated circuit.

An Integrated Circuit for Eeg Acquisition System in 0.18μm Technology

An EEG acquisition system using 0.18μm technology is proposed. EEG input signals are of the range of few micro-voltage. Hence a high gain operational transconductance amplifier with gain of 62.45dB is designed for the acquisition system. The proposed amplifier and multiplexer have been tested for the EEG signals and their performance is reported at operating voltage of 1.8 volts. This design ca...

Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS

As CMOS scaling options are exhausted by fundamental limitations, device and circuit integration in the third-dimension could provide a possible pathway without extensively relying on ultra-scaled transistors. So far, however, the migration of CMOS to 3-D has been unattainable. The CMOS fabric architecture uses complementary MOSFETs in an inverted logic, where both pull-up and pull-down transis...

Monolithic Microwave Integrated Circuit (MMIC) Technology for Space Communications Applications

Mechanical Characterization of Black Diamond (Low-k) Structures for 3D Integrated Circuit and Packaging Applications

© 2012 Nagendra Sekhar, licensee InTech. This is an open access chapter distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Mechanical Characterization of Black Diamond (Low-k) Structures for 3D Integrated C...

Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquidmetals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and fl...